Copper, 99,998% (metals basis)

SKU: 199
CAS # 7440-50-8
Cu
Purity: 99,998%

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Chemical Properties:

Molecular Weight 63.55
Appearance Reddish Metal
Melting Point 1085 °C
Boiling Point 2562 °C
Density 8.96 g/cm3
Thermal Expansion

(25 °C) 16.5 µm·m-1·K-1

Poisson Ratio 0.34
Vickers Hardness 369 MPa
Young's Modulus 110–128 GPa
Thermal Conductivity 401 W ·m-1 ·K-1
Electronegativity 1.90 Paulings
Specific Heat 0.39 kJ/kg K
Heat of Vaporization 300.4 kJ ·mol-1
Heat of Fusion 13.26 kJ ·mol-1

Sparrowchem specializes in producing high purity Copper Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas. Our standard Powder particle sizes average in the range of – 325 mesh, – 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range. Copper can be produced to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available. We also produce Copper as rod, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request.

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